Re-examination on thermal stresses of bonded structures

Journal of Strain Analysis for Engineering Design 2004 / 1 Vol. 39; Iss. 3

Re-examination on thermal stresses of bonded structures

Wang, W-C, Hsu, J-S
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Volume:
39
Language:
english
Journal:
The Journal of Strain Analysis for Engineering Design
DOI:
10.1243/030932404323042687
Date:
January, 2004
File:
PDF, 380 KB
english, 2004
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