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Action of Displacement Control on Vacuum Free Aluminum/Copper Diffusion Liquefaction Bonding
Kawakami, Hiroshi, Kawabe, Toshiharu, Suzuki, JippeiVolume:
638-642
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.638-642.3297
Date:
January, 2010
File:
PDF, 2.69 MB
english, 2010