Analysis of Chip Damage Risk in Thermosonic Wire Bonding

Key Engineering Materials 2011 / 4 Vol. 478

Analysis of Chip Damage Risk in Thermosonic Wire Bonding

Dresbach, Christian, Lorenz, Georg, Petzold, Matthias, Altenbach, Holm
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Volume:
478
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.478.75
Date:
April, 2011
File:
PDF, 2.93 MB
english, 2011
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