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Effect of Laser Parameter on the Bond Characteristics of Sn-3.5%Ag Solder Ball
Kim, Jeng O, Jung, Jae Pil, Lee, Jae Hoon, Suh, Jeong, Kang, Hee ShinVolume:
580-582
Year:
2008
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.580-582.191
File:
PDF, 869 KB
english, 2008