![](/img/cover-not-exists.png)
Electroless Copper Bonding with Local Suppression for Void-Free Chip-to-Package Connections
Koo, Hyo-Chol, Saha, Rajarshi, Kohl, Paul A.Volume:
159
Year:
2012
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.029206jes
File:
PDF, 160 KB
english, 2012