Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various Levelers
Dow, Wei-Ping, Li, Chih-Chan, Lin, Meng-Wen, Su, Ging-Wen, Huang, Chen-ChiaVolume:
156
Year:
2009
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3147273
File:
PDF, 1.03 MB
english, 2009