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Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy
Ramachandran, Koushik, Pruyn, Timothy L., Huang, Timothy, Wang, Yushu, Singh, Preet M., Jud Ready, W., Gerhardt, Rosario A., Sundaram, Venky, Tummala, RaoVolume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-2723-y
Date:
April, 2015
File:
PDF, 4.08 MB
english, 2015