![](/img/cover-not-exists.png)
Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints
Wei, G. Q., Du, L. C., Jia, Y. P., Qi, L.Volume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-2984-5
Date:
June, 2015
File:
PDF, 857 KB
english, 2015