Influence of BaTiO3Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder
Yang, Li, Dai, Jun, Zhang, Yaocheng, Jing, Yanfeng, Ge, Jinguo, Liu, HaixiangVolume:
44
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-015-3796-3
Date:
July, 2015
File:
PDF, 1.62 MB
english, 2015