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Effects of ultra-smooth surface atomic step morphology on chemical mechanical polishing (CMP) performances of sapphire and SiC wafers
Zhou, Yan, Pan, Guoshun, Shi, Xiaolei, Zhang, Suman, Gong, Hua, Luo, GuihaiVolume:
87
Language:
english
Journal:
Tribology International
DOI:
10.1016/j.triboint.2015.02.013
Date:
July, 2015
File:
PDF, 3.27 MB
english, 2015