The pattern of US antidumping: the path from initial filing...

World Trade Review 2003 / 11 Vol. 2; Iss. 3

The pattern of US antidumping: the path from initial filing to WTO dispute settlement

BOWN, CHAD P., HOEKMAN, BERNARD, OZDEN, CAGLAR
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Volume:
2
Language:
english
Journal:
World Trade Review
DOI:
10.1017/s147474560400148x
Date:
November, 2003
File:
PDF, 339 KB
english, 2003
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