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Analytic description, measurements, and modeling of 3D-embedded silicon inductance for High-Performance Hybrid Systems Applications
Descamps, Philippe, Tesson, Olivier, Duplessis, Magali, Pasquet, Daniel, Murray, HuguesVolume:
5
Language:
english
Journal:
International Journal of Microwave and Wireless Technologies
DOI:
10.1017/s1759078713000111
Date:
August, 2013
File:
PDF, 960 KB
english, 2013