Microscopic analysis of the wood bond line using liquefied wood as adhesive
Ugovšek, Aleš, Sever Škapin, Andrijana, Humar, Miha, Sernek, MilanVolume:
27
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1080/01694243.2012.736854
Date:
June, 2013
File:
PDF, 568 KB
english, 2013