Electroplating moulds using dry film thick negative...

Journal of Micromechanics and Microengineering 2003 / 07 Vol. 13; Iss. 4

Electroplating moulds using dry film thick negative photoresist

Kukharenka, E, Farooqui, M M, Grigore, L, Kraft, M, Hollinshead, N
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Volume:
13
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/13/4/311
Date:
July, 2003
File:
PDF, 677 KB
english, 2003
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