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A triple-layer protection process for high-aspect-ratio silicon micromachining by DRIE of SOI substrates
Ma, Zhibo, Jiang, Chengyu, Yuan, WeizhengVolume:
22
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/22/5/055028
Date:
May, 2012
File:
PDF, 232 KB
english, 2012