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A novel analytical thermal model for multilevel nano-scale interconnects considering the via effect
Zhang-Ming, Zhu, Ru, Li, Bao-Tian, Hao, Yin-Tang, YangVolume:
18
Language:
english
Journal:
Chinese Physics B
DOI:
10.1088/1674-1056/18/11/063
Date:
November, 2009
File:
PDF, 659 KB
english, 2009