![](/img/cover-not-exists.png)
Material removal rate in chemical-mechanical polishing of wafers based on particle trajectories
Jianxiu, Su, Xiqu, Chen, Jiaxi, Du, Renke, KangVolume:
31
Language:
english
Journal:
Journal of Semiconductors
DOI:
10.1088/1674-4926/31/5/056002
Date:
May, 2010
File:
PDF, 2.90 MB
english, 2010