Study on the relationship between the surface composition...

IEEE Transactions on Electronics Packaging Manufacturing 1999 / 10 Vol. 22; Iss. 4

Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability

Songhua Shi,, Daoqiang Lu,, Wong, C.P.
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Volume:
22
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/6104.816093
Date:
October, 1999
File:
PDF, 142 KB
english, 1999
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