IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1995 / Feb. Vol. 18; Iss. 1
Cracking failures in lead-on-chip packages induced by chip backside contamination
Amagai, M., Seno, H., Ebe, K.Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.365498
Date:
January, 1995
File:
PDF, 680 KB
english, 1995