IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1996 / Nov. Vol. 19; Iss. 4
![](/img/cover-not-exists.png)
Packaging alternatives to large silicon chips: tiled silicon on MCM and PWB substrates
George, A.G., Krusius, J.P., Granitz, R.F.Volume:
19
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.544360
Date:
January, 1996
File:
PDF, 1.02 MB
english, 1996