[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Cavity-down thermal-enhanced package reliability evaluation for low-k dielectric/Cu interconnects IC
Pei-Haw Tsao,, Chender Huang,, Allan Lin,, Mirng-Ji Lii,, Perng, D.J., Nun-Sian Tsai,Year:
2004
Language:
english
DOI:
10.1109/ectc.2004.1319061
File:
PDF, 194 KB
english, 2004