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[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Drop test reliability of wafer level chip scale packages
Alajoki, M., Luu Nguyen,, Jorma Kivilahti,Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/ectc.2005.1441336
File:
PDF, 2.71 MB
english, 2005