![](/img/cover-not-exists.png)
[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Wafer level package solder joint reliability study for portable electronic devices
Se-Young Jang,, Tae-Sang Park,, Yeon-Sung Kim,, Jae-Woo Jeong,, Jung-Je Ban,, Dong-Ki Kang,Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/ectc.2005.1441339
File:
PDF, 919 KB
english, 2005