[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Effect of silver content and nickel dopant on mechanical properties of Sn-Ag-based solders
Che, F.X., Luan, J.E., Baraton, XavierYear:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550016
File:
PDF, 473 KB
english, 2008