[IEEE 2008 58th Electronic Components and Technology...

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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions

Syed, Ahmer, Scanlan, Joan, SeWoong Cha,, WonJoon Kang,, EunSook Sohn,, TaeSeong Kim,, ChangGyun Ryu,
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Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550168
File:
PDF, 665 KB
english, 2008
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