[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - A comparison study of electromigration performance of Pb-free flip chip solder bumps
Peng Su,, Li Li,, Yi-Shao Lai,, Ying-Ta Chiu,, Chin-Li Kao,Year:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074120
File:
PDF, 1.22 MB
english, 2009