[IEEE 2009 IEEE 59th Electronic Components and Technology...

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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure

Yu, Da-Quan, Chai, Tai Chong, Thew, Meei Ling, Ong, Yue Ying, Rao, Vempati Srinivasa, Wai, Leong Ching, Lau, John H.
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Year:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074124
File:
PDF, 2.08 MB
english, 2009
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