[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Optimization of flexible substrate for COF (chip on flexible) LED packaging
Kim, Young-Woo, Park, Sung-Mo, Kim, Min-Sung, Kim, Jae-Pil, Kim, Jae-Bum, Song, Sang-Bin, Lim, Yeong-SeogYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074288
File:
PDF, 1.43 MB
english, 2009