![](/img/cover-not-exists.png)
[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Mechanical analysis and reliability enhancement of a Proximity Communication flip chip package
Guenin, Bruce, Shi, JingYear:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490905
File:
PDF, 1.09 MB
english, 2010