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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Effects of pad surface finish on interfacial reliabilities of Cu-pillar/Sn-Ag bumps of 2.5D TSV-enterposer on PCB applications
Kim, Youngsoon, Shin, Ji-won, won Choi, Young, Paik, Kyung-WookYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897537
File:
PDF, 949 KB
english, 2014