[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Effect of joint shape controlled by thermocompression bonding on the reliability performance of 60цm-pitch solder micro bump interconnections
Huang, Yu-Wei, Zhan, Chau-Jie, Juang, Jing-Ye, Yu-Mn, Lin, Huang, Shin-Yi, Chen, Su-Mei, Fan, Chia-Wen, Cheng, Ren-Shin, Chao, Shu-Han, Hsieh, Wan-Lin, Chen, Chih, Lau, John H.Year:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897562
File:
PDF, 3.81 MB
english, 2014