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[IEEE 2009 6th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) - Chonburi, Thailand (2009.05.6-2009.05.9)] 2009 6th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology - Low cost hot embossing process for plastics microfluidic chips fabrication
Lomas, T., Mongpraneet, S., Wisitsoraat, A., Jaruwongrungsee, K., Sappat, A., Maturos, T., Chevasuvit, F., Tuantranont, AdisornYear:
2009
Language:
english
DOI:
10.1109/ecticon.2009.5137048
File:
PDF, 635 KB
english, 2009