[IEEE 2013 IEEE International Conference of Electron...

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[IEEE 2013 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC) - Hong Kong, Hong Kong (2013.06.3-2013.06.5)] 2013 IEEE International Conference of Electron Devices and Solid-state Circuits - A new method on Cu stress measurement by bandgap voltage reference circuit

Tan Chan Lik,, Tan Chun Keat,, Thilaga, Govindasamy, Cheng Chin Siong,
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Year:
2013
Language:
english
DOI:
10.1109/edssc.2013.6628233
File:
PDF, 780 KB
english, 2013
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