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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Characterization of Wire Bondability on Overhang Structured Chip in Multi Chip Package

Shin, Dongkil, Kwak, Dongok, Song, Younghee, Chung, Myungkee, Ahn, Eunchul, Cho, Kyoungbok
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Year:
2006
Language:
english
DOI:
10.1109/emap.2006.4430692
File:
PDF, 1.70 MB
english, 2006
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