[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Focused Heat Treatment after Bonding for Cu Wire Bond Reliability Improvement
Yun, Yow Kai, Leng, Eu PohYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763554
File:
PDF, 5.83 MB
english, 2008