[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Effect of TSV interposer on the thermal performance of FCBGA package
Hoe, Yen Yi Germaine, Yue, Tang Gong, Damaruganath, Pinjala, Chong, Chai Tai, Lau, John H., Xiaowu, Zhang, Vaidyanathan, KripeshYear:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416445
File:
PDF, 577 KB
english, 2009