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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Characterization of DAF tape for embedded micro wafer level packaging
Pei-Siang, Sharon Lim, Sharma, Gaurav, Kumar, Aditya, Rao, Vempati Srinivasa, Sheng, Vincent Lee WenYear:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416548
File:
PDF, 1.02 MB
english, 2009