[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - CSP LED validation through optical simulations for high irradiance UV LED module
Lin, Hao-Xiang, Hsu, Chin-Chang, Liao, Cheng-Chun, Chang, Chung-Min, Hsu, Chih-PengYear:
2015
Language:
english
DOI:
10.1109/icep-iaac.2015.7111133
File:
PDF, 850 KB
english, 2015