[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Low-temperature GaAs/SiC wafer bonding with Au thin film for high-power semiconductor lasers

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.