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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Tensile behaviors investigation of SWCNT-Ni with vacancies
Liao, Hengyou, Zhu, Fulong, Zhang, Wei, Chen, Youkai, Song, Shao, Liu, ShengYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474621
File:
PDF, 593 KB
english, 2012