[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - A study of high-density embedded capacitor for silicon-substrate package
Huijuan Wang,, Fengwei Dai,, Guidotti, Daniel, Yao Lv,, Liqiang Cao,, Lixi Wan,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582412
File:
PDF, 782 KB
english, 2010