[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - A novel design of handling system for silicon wafer thinning
Li, Cao, Zhou, Shengjun, Hu, Chang, Wang, Xuefang, Liu, ShengYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066939
File:
PDF, 2.06 MB
english, 2011