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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Reasearch on simulation and experiment of the extrusion process of high conductivity aluminum alloy for electronic packaging
Jinlong, Fu, Kaikun, Wang, Yuanning, Wang, Yuzhi, Wang, Xukun, HeYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756680
File:
PDF, 827 KB
english, 2013