[IEEE Comput. Soc. Press International Conference on Wafer Scale Integration - San Francisco, CA, USA (29-31 Jan. 1991)] 1991 Proceedings, International Conference on Wafer Scale Integration - Layout, design finish and packaging of a redundant signal multiprocessor architecture with WSI dimensions
Link, T., Teich, W., Werner, A.Year:
1991
Language:
english
DOI:
10.1109/icwsi.1991.151720
File:
PDF, 417 KB
english, 1991