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[IEEE International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Irvine, California, USA (March 16-18, 2005)] Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Comparative studies of green molding compounds for the encapsulation of Cu/low-k packages
Chungpaiboonpatana, S., Shi, F.G., Todd, M., Crane, L.Year:
2005
Language:
english
DOI:
10.1109/isapm.2005.1432091
File:
PDF, 2.06 MB
english, 2005