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[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Preparation of copper clad laminates with high performance bismaleimide-based copolymer matrix resins
Zhou, Hongfu, Wang, JianbinYear:
2011
Language:
english
DOI:
10.1109/isapm.2011.6105742
File:
PDF, 141 KB
english, 2011