Visible Light-Emitting Diodes With Thin-Film-Flip-...

IEEE Electron Device Letters 2015 / 7 Vol. 36; Iss. 7

Visible Light-Emitting Diodes With Thin-Film-Flip- Chip-Based Wafer-Level Chip-Scale Package Technology Using Anisotropic Conductive Film Bonding

Lee, Keon Hwa, Kim, Seung Hwan, Lim, Woo-Sik, Song, June-O, Ryou, Jae-Hyun
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Volume:
36
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/led.2015.2434053
Date:
July, 2015
File:
PDF, 1.34 MB
english, 2015
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