Density factor approach to representing impact of die power...

IEEE Transactions on Advanced Packaging 2005 / 11 Vol. 28; Iss. 4

Density factor approach to representing impact of die power maps on thermal management

Torresola, J., Chia-Pin Chiu,, Chrysler, G., Grannes, D., Mahajan, R., Prasher, R., Watwe, A.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2005.858439
Date:
November, 2005
File:
PDF, 238 KB
english, 2005
Conversion to is in progress
Conversion to is failed