Intermetallic Formation of Copper Pillar With Sn–Ag–Cu for...

IEEE Transactions on Components and Packaging Technologies 2008 / 12 Vol. 31; Iss. 4

Intermetallic Formation of Copper Pillar With Sn–Ag–Cu for Flip-Chip-On-Module Packaging

Huang, Mark, Yeow, Ong Gee, Poo, Chia Yong, Jiang, Tom
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2008.2001194
Date:
December, 2008
File:
PDF, 5.05 MB
english, 2008
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