Optimization and evaluation of sputtering barrier/seed...

Tsinghua Science and Technology 2014 / 4 Vol. 19; Iss. 2

Optimization and evaluation of sputtering barrier/seed layer in through silicon via for 3-D integration

Wei, Tiwei, Cai, Jian, Wang, Qian, Hu, Yang, Wang, Lu, Liu, Ziyu, Wu, Zijian
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Volume:
19
Language:
english
Journal:
Tsinghua Science and Technology
DOI:
10.1109/tst.2014.6787368
Date:
April, 2014
File:
PDF, 9.69 MB
english, 2014
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